Welcome to BEI-UHPC

BEI-UHPC, an official symposium of the Bridge Engineering Institute (BEI), is a forum for international researchers and practitioners around the world. State-of-the-art knowledge on Ultra-High Performance Concrete (UHPC) and emerging concrete technologies will be discussed with distinguished speakers in plenary and parallel sessions.


Sponsors and Exhibitors


Time and Venue

Date: June 22-25, 2020

Venue: National University of Singapore

Address: 9 Kent Ridge Drive, Singapore, 119241

For details about the venue, please click here


Important dates

Abstract submission: by Oct. 31, 2019 (extended to Nov. 30, 2019)

Acceptance of Abstracts: by Nov. 15, 2019 (extended to Dec. 15, 2019)

Manuscript submission: by Feb. 1, 2020

Revision of manuscripts: by Mar. 1, 2020

Acceptance of Manuscripts: by Mar. 15, 2020

For submission, please click here


Conference Themes

The main theme of BEI-UHPC is Advances in Concrete Engineering, which will be composed of plenary lectures, parallel sessions, and exhibitions concerning UHPC and emerging concrete. Call for abstracts on session themes is as follows

1. Ultra-high performance concrete

2. State of the art of concrete technologies

3. Internal curing for concrete

4. Material characterization

5. Macro- and micro-structure of concrete

6. Non-destructive testing

7. Numerical analysis/multiscale modeling

8. Techniques for concrete casting and curing

9. Fiber-reinforced concrete

10. FRP-reinforced concrete

11. Supplementary cementitious materials

12. Design and innovation

13. Durability

14. Environmental impact

15. Materials science/mechanics of materials

16. Life cycle-cost analysis

17. Concrete construction

18. Research and development

19. Structural applications

20. Other emerging topics


Plenary Speakers (alphabetical order)

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Sung-Gul Hong

  • Seoul National University
    Korea

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Steven Nolan

  • Florida Department of Transportation
    USA

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Kiang Hwee Tan

  • National University Of Singapore
    Singapore


For details, please click here


Official language

English is the official language of the conference


Proceedings

Manuscripts (four pages maximum) to be submitted will be reviewed by experts in the subject areas. Accepted manuscripts will be published in the Proceedings of BEI-UHPC

The authors are required to follow the following publication ethics: 1) Significant findings that can contribute to the advancement of scientific and engineering knowledge are presented; 2) Each manuscript submitted has detailed and valuable contents for others to repeat and confirm the accuracy; 3) Plagiarism is strictly prohibited in any circumstance; 4) Criticism due to personal reasons is not acceptable; 5) All authors must contribute to the manuscript in terms of writing, ideas, physical testing, and the like; 6) Commercial contents need to be avoid; and 7) Generally acceptable guidelines in the research community are respected


Indexing

The Proceedings of BEI are registered in the United Stated Congress Library under ISSN 2689-2804 and indexed.


Registration

Full registration (BEI Members): US$650 on or before Mar. 30, 2020; US$800 after April 1, 2020

Full registration (Non-members): US$800 on or before Mar. 30, 2020; US$1,000 after April 1, 2020

Student registration: US$500 on or before Mar. 30, 2020; US650 after April 1, 2020

Accompanying person: US$300

For registration, please click here


The full and student registrations include access to all technical sessions and plenary speeches, welcome reception, lunch, coffee breaks, a symposium banquet, and online proceedings

The accompanying person registration includes welcome reception, lunch, coffee breaks, and a symposium banquet

Listener registration will be the same as the Full registration, including all functions

Cancellation will be available until April 30, 2020 and a refund will be made accordingly, except for a service charge of 20%. No refund will be made after May 1, 2020


Name badges

Only registered attendees with name badges will be permitted to attend BEI-UHPC functions


Visa

BEI will provide a letter of invitation to those who need a Visa to attend the conference (email: bei_institute@outlook.com)


Accommodation

There are many hotels in Singapore. If one wants to stay on campus, the following will be available (3-10 minutes of walking to the venue):

please click here

For reservation, please email your name, number of persons, paper ID, and preferred units (PGPR, RVRC, Kent Ridge Hall, and Sheres Hall) at bei_institute@outlook.com


Becoming a sponsor

BEI-UHPC is one of the major conferences in concrete engineering. Your company will have a great opportunity to communicate with leading engineers and owners as well as with conference delegates. Spaces for exhibition will be provided for you to promote products and services concerning the technical specialties of your company. Social events of the conference will be another exciting chance to attract the participants of the symposium. Your support will be officially acknowledged whenever available during the course of the symposium, which will maximize the visibility of your company. For further information and sponsorship, please contact the organizers of the symposium (email: bei_institute@outlook.com).


Symposium Chair

Yail Jimmy Kim (USA)


Organizing Committee

Kian Hau Kong (Singapore)

Min-Hong Zhang (Singapore)

Kiang Hwee Tan (Singapore)

Isamu Yoshitake (Japan)

Vanissorn Vimonsatit (Australia)

Xuhui He (China)


International Scientific Committee (Alphabetical order)

Riadh S Al-Mahaidi (Australia)

Shanaka Kristombu Baduge (Australia)

Brahim Benmokrane (Canada)

Steve Cai (USA)

NY Chang (USA)

Mark Green (Canada)

Issam Harik (USA)

Sung-gul Hong (Korea)

William Wai Yeong Huen (Australia)

Venkatesh Kodur (USA)

Hyuk Lee (Australia)

Guangcheng Long (China)

Urs Meier (Switzerland)

Hiroshi Mutsuyoshi (Japan)

John Myers (USA)

Antonio Nanni (USA)

Steven Nolan (USA)

Seeram Ramakrishna (Singapore)

Saiid Saiidi (USA)

Rafat Siddique (India)

Jim Shiau (Australia)

Myoungsu Shin (Korea)

Johan L Silfwerbrand (Sweden)

Jongsung Sim (Korea)

Ertugrul Taciroglu (USA)

Dan Tobias (USA)

Mark Williams (USA)

Qiang Yuan (China)


Conference Secretariat

Yongcheng Ji (China)