Welcome to BEI-2023

BEI-2023, an official conference of the Bridge Engineering Institute (BEI), is a forum for international researchers and practitioners around the world. State-of-the-art knowledge on bridge engineering and related fields will be discussed with distinguished speakers in plenary and parallel sessions. BEI-2023 will be held in Rome, Italy, with which a number of world-class cultural heritage and fun activities are associated.


Sponsors and Exhibitors (more to be added)

 



Time and Venue

Date: July 17-20, 2023

Venue: Roma Eventi-Fontana di Fontana Trevi

Address: Piazza Della, Pilotta, 4-00187, Roma, Italia


Important dates

Abstract submission: by Dec. 15, 2022
(each registration may cover up to two abstracts/presentations upon acceptance)
(If one is under the influence of the COVID lockdown, registration will be extended without any penalty until it is lifted)

Acceptance of Abstracts: by Dec. 31, 2022

Manuscript submission: by Feb. 15, 2023

Revision of manuscripts: by Mar. 15, 2023

Acceptance of Manuscripts: by Mar. 30, 2023

For submission, please click here


Conference Themes

The main theme of BEI-2023 is Frontiers of Bridge Engineering, which will be composed of plenary lectures, parallel sessions, panel discussions, and exhibitions concerning bridge engineering and related fields. Call for abstracts on session themes is as follows

1. Construction materials

2. Mechanics of materials

3. Laboratory- and large-scale testing

4. Modeling and analysis

5. Construction, maintenance, repair, and rehabilitation

6. Application of fiber-reinforced polymer (FRP) composites

7. Reliability investigations

8. Soil-structure interaction

9. Dynamics, earthquake, wind, impact, and vibration control

10. Structural health monitoring/non-destructive testing

11. Design and innovation

12. Railway and pedestrian bridges

13. Ultra-high performance concrete (UHPC)

14. Load characteristics

15. Management and life cycle-cost analysis

16. Accelerated bridge construction (ABC)

17. Research and development

18. Other emerging topics


Plenary Speakers (alphabetical order)

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Issam Harik

  • University of Kentucky
    USA

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Antonio Nanni

  • University of Miami
    USA

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John Myers

  • Missouri University S&T
    USA

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Takashi Yamane

  • Kyokuto Kowa Corp.
    Japan


For details, please click here


Mini-symposia

Proposals for mini-symposia will be accepted until Nov. 31, 2022 (email: bei_institute@outlook.com)


Official language

English is the official language of the conference


Proceedings

Manuscripts (four pages maximum) to be submitted will be reviewed by experts in the subject areas. Accepted manuscripts will be published in the Proceedings of BEI-2023

The authors are required to follow the following publication ethics: 1) Significant findings that can contribute to the advancement of scientific and engineering knowledge are presented; 2) Each manuscript submitted has detailed and valuable contents for others to repeat and confirm the accuracy; 3) Plagiarism is strictly prohibited in any circumstance; 4) Criticism due to personal reasons is not acceptable; 5) All authors must contribute to the manuscript in terms of writing, ideas, physical testing, and the like; 6) Commercial contents need to be avoid; and 7) Generally acceptable guidelines in the research community are respected


Indexing

The Proceedings of BEI are registered in the United Stated Congress Library under ISSN 2689-2804 and indexed.


Registration

Full registration (BEI Members): US$950 on or before April 15, 2023; US$1,100 after April 15, 2023

Full registration (Non-members): US$1,100 on or before April 15, 2023; US$1,200 after April 15, 2023

Student registration: US$750 on or before April 15, 2023; US850 after April 15, 2023

Accompanying person: US$300

For registration, please click here


The full and student registrations include access to all technical sessions and plenary speeches, welcome reception, lunch, coffee breaks, a conference banquet, and online proceedings

The accompanying person registration includes welcome reception, lunch, coffee breaks, and a conference banquet

Listener registration will be the same as the Full registration, including all functions

Cancellation will be available until May 30, 2023 and a refund will be made accordingly, except for a service charge of 20%. No refund will be made after June 1, 2023.

BEI will do its very best to accommodate the need of all attendees. However, the Institute denies any responsibilities and accepts no liability whatsoever for any circumstance related to this conference.


Name badges

Only registered attendees with name badges will be permitted to attend BEI-2023 functions


Visa

BEI will provide a letter of invitation to those who need a Visa to attend the conference (email: bei_institute@outlook.com)


Accommodation

A number of hotels are available in Rome


Becoming a sponsor

BEI-2023 is one of the major conferences in bridge engineering and related fields. Your company will have a great opportunity to communicate with leading bridge engineers and owners as well as with conference delegates. Spaces for exhibition will be provided for you to promote products and services concerning the technical specialties of your company. Social events of the conference will be another exciting chance to attract the participants of the conference. Your support will be officially acknowledged whenever available during the course of the conference, which will maximize the visibility of your company. For further information and sponsorship, please contact the organizers of the conference (email: bei_institute@outlook.com).


Conference Chair

Yail Jimmy Kim (USA)


Organizing Committee

Isamu Yoshitake (Japan): Chair

Vanissorn Vimonsatit (Australia)

Xuhui He (China)


International Scientific Committee (Alphabetical order)

Riadh S Al-Mahaidi (Australia)

Toshihiko Aso (Japan)

Brahim Benmokrane (Canada)

Steve Cai (USA)

NY Chang (USA)

Mark Green (Canada)

Issam Harik (USA)

Tatsumasa Kaita (Japan)

Andreas Kappos (United Arab Emirates)

Venkatesh Kodur (USA)

Urs Meier (Switzerland)

Hiroshi Mutsuyoshi (Japan)

John Myers (USA)

Hideaki Nakamura (Japan)

Antonio Nanni (USA)

Sriram Narasimhan (USA)

Steven Nolan (USA)

Saiid Saiidi (USA)

Xianming Shi (USA)

Jim Shiau (Australia)

Johan L Silfwerbrand (Sweden)

Jongsung Sim (Korea)

Ertugrul Taciroglu (USA)

Su Taylor (UK)

Dan Tobias (USA)

Mark Williams (USA)

Takashi Yamane (Japan)

Zhiwen Zhu (China)


Conference Secretariat

Yongcheng Ji (China)